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Our manufacturing team has experience with a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support. |
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| BOARD TYPES |
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CEM 1, CEM3 and FR4
Polyimide
Teflon
Flex, Getek and Rigid-Flex
High Temperature FR-4 & FR-5 |
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| SPECIAL CAPABILITIES |
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Fine lines and SMT pitch
Board thickness 0.008 to 0.250
Carbon Ink Contacts
Oversized multilayer boards
Ball Grid Array (BGA) patterns
Blind and buried vias
Peelable/Water soluble masks
Plated slots and edges |
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| SURFACE FINISHES |
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Solder Mask Over Bare Copper (SMOBC)
Hot Air Leveled Solder coating
Electroless nickel/gold (including bondable gold)
Electroless White Tin
Electroless Silver
Entek
Screenable silver and carbon
Heavy copper layers
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| ENGINEERING SERVICES |
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Integrated CAM and laser photo plotting
Array Design/Penalization
Design For Manufacturability (DFM)
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| TESTING |
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Precision Gold and Copper thickness measurement
Ionic Contamination
100% Node and Netlist Testing
Clam Shell electrical testing
Flying grid electrical testing
SMT fixtures build in-house
Certified test results
Statistical Process Control (SPC)
AOI system for inner and outer layers
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| PROCESSING |
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Largest panel size -16 x 27
Maximum number of layers -8
Minimum circuit width -.005
Smallest finished hole -.008
Maximum finished copper -5 oz
PTH tolerance -+/- .003
Routed feature tolerance -+/- .005
Solder mask opening allowance
Wet mask -.010 per side
LPI - .0025 per side
Annular ring PTH hole +/- .005
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